Removable Cooling Duct With Interlocking Dovetail Connections For An Air Tight Thermal Seal

ABSTRACT

A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed portion and a removable portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the first and second thermal duct portions such that the block can be secured at least partially to either/or thermal duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to cooling of electronic packages and moreparticularly to cooling of electronic components used in a computingsystem environment.

2. Description of Background

The industry trend has been to continuously increase the number ofelectronic components inside computing systems environments. A computingsystem environment can simply comprise of a simple personal computer orbe a complex network of large computers in processing communication withone another. While increasing the components inside a simple computingsystem environment does create some challenges, however, such anincrease create many problems in computing system environments thatinclude large computer complexes. In such instances many seeminglyisolated issues affect one another, and have to be resolved inconsideration with one another. This is particularly challenging inenvironments where the computers in the network are either packaged in asingle assembly or housed and stored in close proximity.

One such particular challenge when designing any computing systemenvironment is the issue of heat dissipation. Heat dissipation ifunresolved, can result in electronic and mechanical failures that willaffect overall system performance, no matter what the size of theenvironment. As can be easily understood, the heat dissipation increasesas the packaging density increases. In larger computing systemsenvironments, however, not only the number of heat generating electroniccomponents are much larger than that of smaller environments, butthermal management solutions must be provided that take other needs ofthe system environment into consideration. Furthermore, improper heatdissipation can create a variety of other seemingly unrelated problemsranging from dynamic loading problems affecting structural rigidity ofthe computing system environment, to cost prohibitive solutions toprovide proper air conditioning to customer sites where such computingsystem environments are being stored.

In some computing environments, heat dissipation issues are addressed bymoving air over and at times through electronic devices and componentsthat are to be cooled. In many instances, to properly cool an electronicdevice by moving air over and thru it, a thermal duct is used. In theprior art currently being used, the thermal duct is often sealed to thedevice. Unfortunately, in many instances, especially when servicing orinstallation of new components is involved, the thermal duct must beremoved to access the components that are underneath it. This createsdifficulties, especially in instances where the removal of the duct hasto be repeated with some frequency. Consequently, a system and method isneeded that allows for easy removal and re-installation of thermal ductswhich are necessary in some applications.

SUMMARY OF THE INVENTION

The shortcomings of the prior art are overcome and additional advantagesare provided through the provision of a method and incorporated assemblyfor cooling of an electronic device or component. The assembly comprisesa thermal duct having a fixed portion and a removable portion. Theportions each have complementary interlocking components to secure themto one another. Also a first attachment block is provided. The firstattachment block has complementary interlocking portions with the firstand second thermal duct portions such that the block can be secured atleast partially to either/or thermal duct portion. A second attachmentblock is also provided that has a complementary interlocking portionwith the removable duct portion. This second attachment block can besecured to one or more electronic devices requiring cooling. In oneembodiment, a standoff can also be provided to address any heightrestrictions and or needs for the securing of the thermal duct. Thestandoff can be at least partially secured to thermal duct and when usedto a computer mounting board or plate.

Additional features and advantages are realized through the techniquesof the present invention. Other embodiments and aspects of the inventionare described in detail herein and are considered a part of the claimedinvention. For a better understanding of the invention with advantagesand features, refer to the description and to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter which is regarded as the invention is particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The foregoing and other objects, features, andadvantages of the invention are apparent from the following detaileddescription taken in conjunction with the accompanying drawings inwhich:

FIG. 1 is a perspective side view illustrations of a cooling assembly asper one embodiment of the present invention; and

FIG. 2 is a perspective side view illustration of the assembly of FIG. 1disposed in a computing system environment.

DESCRIPTION OF THE INVENTION

FIG. 1 is a side view perspective illustration of one embodiment of thepresent invention. The assembly in FIG. 1 is comprised of a variety ofmembers, that when disposed in conjunction with one another, form aremovable duct.

Thermal ducts, in general, are used in heating, ventilation and aircooling of devices to deliver and/or to remove air. Thermal ducts usedto cool electronic devices are used in the same capacity, including theones used in large computing environments. In prior years, these thermalducts were disposed in desired areas and then sealed to optimizecooling. This was an adequate solution if the ducts were not to beremoved, or at least not to be removed frequently. With the advent oftechnology, at least in computer industry, the need to repeatedly insertand remove these ducts has grown. An increased number of electroniccomponents disposed in a very cramped and limited foot print has made itvital to remove these ducts during installation and service calls toreach areas behind the ducts or components being cooled by these ducts.Therefore, the need to have an easily removable cooling duct has becomean important issue to address. The embodiment of FIG. 1 provides aremovable cooling duct that can be repeatedly removed and replaced suchas during service calls.

In FIG. 1, an interlocking duct 100 is provided comprising of twointerlocking ducting portions or components referenced by numerals 110and 120 respectively. In one embodiment, the two portions or components110 and 120 are complementary in shape and interlocking. In a preferredembodiment, the two portions or components are dovetailed in shape asshown in the figures. The illustration of FIG. 1, reflects such anembodiment.

In FIG. 1, the first portion 110 by way of example is provided toreflect having a female profile while the second portion 120 is its malecounterpart. This arrangement, is only provided as a way of example,however, and in alternate embodiments other similar arrangements asknown to those skilled in the art is also achievable.

The first portion 110 comprises a fixed duct sub-assembly as shown andreferenced by numerals 112. The second portion 120 further comprises aremovable duct sub-assembly as illustrated and referenced by numerals122.

A first and second attachment block is also provided. As provided in thefigure, the first attachment block is referenced as 151 while the secondattachment block is referenced as 162. The attachment blocks 151 and162, as will be discussed later, are provided to attach to differentcomponents of a device or electronic component. In a preferredembodiment, both blocks 151 and 162 present a female type dovetailprofile. This particular arrangement, however, can be altered indifferent embodiments to address particular needs.

It should be noted that the removable duct 122 sub-assembly (hereinafterremovable duct 122) has several engagement attachment parts itself thatare all collectively referenced as 124. In this embodiment, theengagement attachments are provided on a plurality of different sides ofthe removable duct 122 to later ensure a proper securing and fit withdifferent components as will be discussed. Mainly one engagementattachment is provided to interlock with each attachment block (151 and163) at least partially, while another one is provided to interlock withthe fixed thermal duct portion 112. In this example the removableportion of the duct 122 has a male profile (124) on all sides, whileboth the fixed portion and all the attachment blocks have a femaleprofile. It is possible, however, for the removable duct portion 122 tohave different profiles on different sides and for the attachment blocksand the fixed portion to have different profiles. In addition, in theembodiment of FIG. 1, the interlocking part 124 that will engage withsecond attachment block 163 is more prominently visible, but others aresimilar in nature even through the engaging part may not be as easilyvisible.

Once the blocks are attached, their placement, as will be seen later,will be such that they will be disposed on substantially perpendicularplanes to one another. To ease understanding, in the illustrated figure,a legend is provided that show the direction of the almost 90 degreerotation. The female type dovetail profiles of the blocks are referencedas 153 and 163 respectively as illustrated.

The cooling duct 100 will then be secured to the attachment blocks aswill be discussed. The fixed portion 112 of the cooling duct 100 will besecured on one side to the removable portion 122. On an adjacent side,the fixed cooling duct 112, which is a part of the first portion 110,will then be then partially secured to the first attachment block 151.In one embodiment, the cooling duct 112 would be fabricated such thatthe block and the fixed duct are interlocking secured. The remainingportion of the first attachment block will be secured later to theremovable portion 122 of the duct as will be discussed. To provide forbetter reference, the receiving part is referenced by numerals 113,although it is difficult to view this from the angle perspective of FIG.1 as stated earlier. This receiving part 113 will interlock with theattachment part of the removable duct 122 as referenced earlier bynumerals 124.

In a preferred embodiment, the attachment block 151 will be pre-attachedto other components or mounted to a frame or frame side before the fixedduct 112 is secured to it, but this is not a requirement and they canfirst be interlocking secured, if desired. To provide for betterreference, the receiving part is referenced by numerals 113, although itis difficult to view this from the angle perspective of FIG. 1 (it ishidden). Similarly the engagement attachment part is referenced bynumerals 124.

In a preferred embodiment, the fixed cooling duct 112 in turn is thenmounted to a mounting plate (not shown in FIG. 1) or other componentsfor further securing. Any securing means known to those skilled in theart, can be provided for this attachment. An example can be standoffsand screws but other means can be used. It should be noted that the twoblocks 151 and 162, in this embodiment do not directly attach to fixedcooling duct 112. However, the removable duct 122 as will be discussedwill be in contact with the blocks and the fixed cooling duct 112 duringits engagement phase.

The second attachment block 162 is then secured to the to-be-cooleddevice. In a preferred embodiment, as stated earlier, the first andsecond attachment blocks 151 and 162 will be on substantiallyperpendicular planes. The removable portion 122 of the thermal duct 100is then disposed between the fixed duct portion 112 and the secondattachment block 162. In the preferred embodiment, where an interlockingdovetail is used, the interlocking dovetail should become fully engagedto ensure full extent of the movement. At this point, the bottom of thefirst and second portions 110 and 120 are disposed such that it will bephysically impossible to move them any further. In some embodiment, itmay be necessary to exert some amount of force to ensure completeengagement of the two portions 110 and 120.

Once the two portions 110 and 120 are fully engaged, it is possible toremove and reinsert the removable duct portion 120. In this embodiment,the duct would be removed by pulling it, by itself, and in asubstantially straight direction until it is completely separated fromthe assembly and disengaged from it.

To replace the removable duct 122 back into its previous position, suchas the end of a service call completion, the removable duct portion 122is again reinserted by aligning the dovetail features first. Theremovable duct 122 is then again disposed between the fixed duct 110 andthe second attachment block 162 until the dovetail features are engagedto the full extent of the movement. Some force or pressure can beexerted until the two bottoms of the two portions 110 and 120 no longercan be moved any closer.

FIG. 2 is an illustration of another side view perspective of thecooling assembly of FIG. 1 but as placed in a computer environment. Theillustration of FIG. 2 provides an example of the use of the presentinvention and is solely provided to ease understanding. Therefore, itshould not be used to place any limitations on the scope of the presentinvention as previously discussed.

In FIG. 2, a computer card or board is illustrated and referenced bynumerals 200. The board 200 comprises a number of components. To easeunderstanding, component referenced by numerals 210 is chosen in thisembodiment to represent the “to-be-cooled” component. The board also iscomprised of a mounting surface 202 that is also interchangeablyreferenced herein as mounting plate 202. Many of the to be cooleddevices and components, including component 210, that is selected by wayof example here, are secured to the mounting plate 202 as shown. Itshould be noted that more than one component and/or device can beselectively cooled using the teachings of the present invention and theexample provided in this figure is made simple to ease understanding.

As can be seen in the illustration of FIG. 2, the two blocks 510 and 620are already secured to different location on the board 200. The secondattachment block 620 is secured to the “to be cooled” device 210. Thefirst attachment block 151 is secured to the side 205 of the board ormounting plate 200/202 as shown, but other arrangements are possible inalternate embodiments as was earlier discussed.

As shown in the figure, the two attachment blocks 510 and 620 aredisposed as to be substantially perpendicular to one another. Fixed duct112 is also secured to the board 200 as shown. In this example, fixedduct 112 is secured directly to the mounting plate 202 while otherarrangements are possible.

In addition, as can be viewed from the example illustrated in thefigure, the fixed portion of the duct (112) is partially secured tofirst attachment block 151, with a remaining portion (referencedseparately as 252) remaining to be later secured to the removableportion of the duct 122. The fixed portion 112 and the attachment blocksare disposed such that the first attachment block 151 is disposed on aplane between the fixed duct 112 and the second attachment block 162.

Furthermore, in this embodiment, the placement of the fixed duct 112 issuch that it is disposed on a substantially parallel plane to that ofthe second attachment block 162, disposing the fixed duct 112 on asubstantially perpendicular plane with that of the first attachmentblock 151 as was discussed earlier in conjunction with the relativeplacement of the two attachment blocks.

It should also be noted that to ease accessibility to other componentsand/or to better provide an interlocking fit for the thermal duct 100,at least part of the thermal duct can be mounted on a standoff. Toprovide an example of this concept, as shown in FIG. 2, the fixedportion of the duct 112 is shown to be mounted on a standoff 290. Inthis example, the standoff comprises of a mounting surface 292 withsides 291 and legs 293 as referenced. The standoff is at least partiallymounted (by its legs) to the mounting plate 202 using means known tothose skilled in the art. In this example, the legs are adjusted toachieve a desired height. They can be designed to address even aplurality of adjustment heights. The use of the standoff provides for anoptional alternate embodiment. Other standoff arrangements can also beprovided if desired to address specific electronic componentarrangements and needs.

In the view provided by the illustration of FIG. 2, the removableportion of the duct 122 is disengaged. This view can happen at a pointeither prior to installation of the duct itself, or just prior or aftera service call such that access can be made to the “to be cooled”component 210 or other components that can be disposed in locationswhere the placement of removable duct makes their servicing difficult.Therefore, the removable portion of the duct 120 can be viewed in asuspended state above the board 200.

As was discussed in conjunction with the embodiment of FIG. 1, a firsttime installation or a re-application of the duct would be easilyachieved at this point by inserting the removable portion in the openingreferenced by numerals 230. This opening as shown is disposed betweenthe fixed duct 112 and the two attachment blocks 151 an 162.

Once disposed in place, the interlocking engagement attachment parts ofthe removable portion (in this case the male counterparts) 124, willengage not just the second attachment block 162, but also the fixed ductportion 112 and the first attachment block 151 on different sides.

Once the removable portion 122 is disposed in place and the interlockingparts are engaged with one another, it may be necessary to exert somepressure to ensure that the dovetail feature is engaged to the fullextent of movement, as discussed earlier. This point will happen whenthe bottom of the removable portion is firmly bottomed out on all sideswith the block attachments and the fixed duct 112. In an alternateembodiment, it is possible to have a retracting interlocking portion onthe removable side 122 that is fully retracted while the removable ductis being installed or removed, but is fully extended once the side 122is disposed between the fixed duct 112 and the second attachment block162 such that one or all interlocking counterparts 124 extend into thereceiving counterparts on one or a plurality of sides. This is to ensurea very tight and secure fit that does not require application ofadditional force. In such a case, one or more, release buttons can beprovided to retract or fully expand the retracting components. Otherarrangement as known to those skilled in the art is possible.

As before, once it is desired to remove the removable side 122, the sidecan be simply disengaged and then pulled out until it becomes completelyseparated as shown in the figure.

Among many advantages as discussed earlier, the assembly and the methodand arrangement of the present invention, as discussed allows for one ormore electronic devices and/or components to be properly cooled bymoving air over and through them using a thermal duct that does notrequire sealing. Similarly, the present invention does not provide aneed for thermal foams or other components that can be costly anddifficult to apply.

While the preferred embodiment to the invention has been described, itwill be understood that those skilled in the art, both now and in thefuture, may make various improvements and enhancements which fall withinthe scope of the claims which follow. These claims should be construedto maintain the proper protection for the invention first described.

1. A removable cooling assembly used for cooling of electronic devices,comprising: a thermal duct comprising of a fixed portion and a removableportion; said portions having complementary interlocking components suchthat said two portions can be secured to one another; a first attachmentblock having complementary interlocking portions with said first andsecond thermal duct portions such that said block can be secured atleast partially to either/or thermal duct portion; a second attachmentblock also having a complementary interlocking portion with saidremovable duct portion; and said second attachment block being capableof being secured to one or more electronic devices requiring cooling. 2.The assembly of claim 1 wherein said attachment blocks capable of beingattachable to one or more electronic components.
 3. The assembly ofclaim 2, wherein said first attachment block can be secured to amounting plate.
 4. The assembly of claim 1, wherein said thermal ductcan at least be partially secured to a mounting plate.
 5. The assemblyof claim 4, wherein said thermal duct can at least be partially securedto a mounting plate via standoff having adjustable legs to address anyheight restriction needs for said thermal duct.
 6. The assembly of claim5, wherein said standoff also comprises a mounting surface and sides forhousing said fixed thermal duct portion.
 7. The assembly of claim 1,wherein said interlocking components of said removable duct portion aredisposed on three of its sides.
 8. The assembly of claim 7, wherein twoof said three sides are on substantially perpendicular planes.
 9. Theassembly of claim 8, wherein two of said three sides are onsubstantially parallel planes.
 10. The assembly of claim 1, wherein saidinterlocking portions of said removable duct are retractable.
 11. Theassembly of claim 1, wherein said interlocking part of said removableduct portion has at least one male profile.
 12. The assembly of claim10, wherein said interlocking part of said fixed duct portion that is tointerlock with said removable duct portion has a female profile.
 13. Theassembly of claim 1, wherein said interlocking part of said removableduct portion has a plurality of male profiles.
 14. The assembly of claim13, wherein said interlocking part of said fixed duct portion has afemale profile.
 15. The assembly of claim 10, wherein said interlockingpart of said attachment blocks each have a female profile.
 16. Theassembly of claim 14, wherein said interlocking components of saidremovable duct portion are disposed on three of its sides.
 17. Theassembly of claim 15, wherein two of said three sides are onsubstantially perpendicular planes.
 18. The assembly of claim 16,wherein two of said three sides are on substantially parallel planes.19. The assembly of claim 17, wherein said interlocking portions of saidremovable duct are retractable.
 20. A method of cooling electroniccomponents disposed on a mounting board comprising the step: disposing aplurality of attachment blocks such that at least one block is securedto a component that is to be cooled, said attachment blocks beingdisposed substantially perpendicular to one another; providing aremovable thermal duct having a fixed portion and a removable portionwith complementary interlocking parts; said removable portion alsohaving a plurality of interlocking complementary portions that can beused in conjunction with said blocks; disposing said fixed portion ofsaid duct such that said removable portion can be disposed between saidfixed portion and at least one of said attachment blocks such that saidcomplementary portion of said removable portion is engaged with both thefixed portion and said two blocks and said fixed portion is at leastpartially engaged with said block that is not secured to said to becooled component.